Excellent hardware integration
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- only one free door flange is used
- one compact laser optic with variable spot size
- water cooled substrate holder protects the SEM stage
- all detectors are possible
- FIB
- inlens BS
- 2nd BS
- EBSD
- compact electronic box includes all necessary electronic
- simple software control via TCP/IP
- GUI controlled via SYNERGY from the SEM keybord/mouse
Substrate heating up to 1200°C at the AURIGA compact
Internal laser beam line with vacuum flange
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- Heating to 1000°C and above
- High temperature dynamics
- Adaptable to most SEM‘s
- Highly flexible sample stage with flexible pre tilting angle
- Minimized thermal effect to the SEM and ist different detectors
Simple but accurate substrate placement
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- Pre tilted sample holder with variable angle for EBSD integration
- Water cooled interconnection base
- SURFACE laser heater substrate carrier plate with penetrating TC and laser cutted sample size structure for best temperature homogeneity
- Laser optic is exactly coupled with the substrate position during sample motion
- Optional bias capability to compensate the thermal electron effect to the contrast
Powerful user interface
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- Windows based GUI with highly flexible access to all temperature control software features:
- Constant temperature with variable ramp up speed from 0 - 1000°C/min
- Cycling between two temperature level with variable ramp up speed and defined cycle numbers
- Temperature control either by TC or pyrometer
- Realtime graphs
- Variable sample frequency of the temperature reading of up to 10 kHz
- Integrated script language for high speed processes with max.ramp up speed of 500 °C/sec
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Option: Fast cooling upgrade for AURIGA laser heater
Laser flange
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- laser head with two light fiber and spot position adjustment
- separate TC feedthrough
- optional grid potential feedthrough
Cooling flange
- pneumatical interface with adjustable pressure for variable contact force
- water cooling
- optional lN2 cooling
Software controlled cooling cycle
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- variable cooling speed from 0,1 - >100°C/sec*)
- medium temperature for isothermal treatment
- separate annealing steps
- extreme application
- cooling down to -100°C
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