Presented with a need to provide a fast and reliable method to acquire mechanical data on uncut silicon wafers, our engineers developed an aggressive solution—NANO Indenter XPW. Equipped with a sample stage supporting test specimens with diameters up to 300 mm, it accomodates nearly all industry needs.
Based on proven NANO Indenter technology, the XPW characterizes surfaces down to the level of a few nanometers. Properties such as hardness and modulus of elasticity at this scale can have significant effect on yield, performance, and longevity of semiconductor devices. As a singular system, it features robust design, easily-used software interface that simplifies testing, and quick-and-clean specimen loading. With its 23-bit electronics and exceptional data-sampling rates, the NANO Indenter XPW provides you with the most accurate data available on instrumented indentation systems.
Like other NANO Indenter systems, the XPW works by making a controlled indentation with its diamond indenter tip. With indenter displacement continuously monitored, it provides hardness of the test specimen, Young’s modulus, fracture behavior, and other mechancial properties data calculations. |
The NANO Indenter XPW is software-controlled and easy to use. Operators need only decide where to put the indentations and what experiments to perform at those positions. The XPW is capable of automated testing, ensuring that each test is consistent, appropriate, and accurate.
The most robust and comprehensive indentation system available
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